EP2A15B724C9 vs EP2A15F672C7N Perbandingan
Perbandingan bersamaan detil EP2A15B724C9 dari Intel dan EP2A15F672C7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2A15B724C9 | EP2A15F672C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Series | APEX II | — |
| Family | APEX II (EP2A15) | APEX II |
| Logic Elements | 16640 | — |
| Number of Gates | 600000 | — |
| Embedded Memory (RAM bits) | 425984 | — |
| User I/O Count | 492 | — |
| Supply Voltage (Core) | 1.5 V | — |
| I/O Voltages Supported | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) | — |
| Process Technology | 0.15 µm all-layer copper (up to 8 metal layers) | 0.15 µm all-layer copper CMOS |
| Maximum Internal Frequency | 500 MHz | 500 MHz |
| LVDS Data Rate | Up to 1 Gbps (True-LVDS) | Up to 1 Gbps (True-LVDS) |
| Interface Standards | LVDS, LVPECL, PCML, HyperTransport | — |
| Embedded Memory Type | ESB - dual-port RAM / ROM / FIFO / CAM | — |
| Clock Management | On-chip PLLs | — |
| Paket | 724-ball FCBGA (Fine-pitch Chip-Scale BGA) | 672-ball FC-FBGA (FineLine BGA) |
| Suhu Kerja | Commercial (0 °C to +85 °C) | Commercial (0C to +85C) |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Elements (Cells) | — | 16,640 |
| Embedded Memory Bits | — | 425,984 |
| User I/Os | — | 492 |
| Metal Layers | — | Up to 8 |
| Core Voltage | — | 1.5 V |
| Speed Grade | — | -7 |
| I/O Standards Supported | — | LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL |
| Configuration Methods | — | JTAG, Passive Serial |