EP2A15B724C9 vs EP2A15F672C7N 比較
詳細並排比較 EP2A15B724C9 由 Intel 與 EP2A15F672C7N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2A15B724C9 | EP2A15F672C7N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | Obsolete |
| Series | APEX II | — |
| Family | APEX II (EP2A15) | APEX II |
| Logic Elements | 16640 | — |
| Number of Gates | 600000 | — |
| Embedded Memory (RAM bits) | 425984 | — |
| User I/O Count | 492 | — |
| Supply Voltage (Core) | 1.5 V | — |
| I/O Voltages Supported | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) | — |
| Process Technology | 0.15 µm all-layer copper (up to 8 metal layers) | 0.15 µm all-layer copper CMOS |
| Maximum Internal Frequency | 500 MHz | 500 MHz |
| LVDS Data Rate | Up to 1 Gbps (True-LVDS) | Up to 1 Gbps (True-LVDS) |
| Interface Standards | LVDS, LVPECL, PCML, HyperTransport | — |
| Embedded Memory Type | ESB - dual-port RAM / ROM / FIFO / CAM | — |
| Clock Management | On-chip PLLs | — |
| 封裝 | 724-ball FCBGA (Fine-pitch Chip-Scale BGA) | 672-ball FC-FBGA (FineLine BGA) |
| 工作溫度 | Commercial (0 °C to +85 °C) | Commercial (0C to +85C) |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Elements (Cells) | — | 16,640 |
| Embedded Memory Bits | — | 425,984 |
| User I/Os | — | 492 |
| Metal Layers | — | Up to 8 |
| Core Voltage | — | 1.5 V |
| Speed Grade | — | -7 |
| I/O Standards Supported | — | LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL |
| Configuration Methods | — | JTAG, Passive Serial |