EP2A25B652C9 vs EP2A15B652C9 Perbandingan
Perbandingan bersamaan detil EP2A25B652C9 dari Intel dan EP2A15B652C9 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2A25B652C9 | EP2A15B652C9 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Device Family | APEX II (EP2A25) | — |
| Logic Elements | 24,320 | 15,600 |
| Paket | 652-ball FineLine BGA | 652-ball FineLine BGA |
| Speed Grade | C9 (-7 commercial) | -9 (fastest APEX II commercial) |
| Process Technology | 0.18 µm CMOS | — |
| Rentang Suhu Kerja | [DATA_NEEDED: commercial/industrial temperature range] | — |
| Core Voltage (VCCINT) | 1.8 V | — |
| I/O Voltage Standards | LVTTL, LVCMOS, SSTL, LVDS | 1.5 V, 1.8 V, 2.5 V, 3.3 V (LVTTL, LVCMOS, LVDS, SSTL, HSTL) |
| Configuration Interface | JTAG (IEEE 1149.1), passive serial, MAX configuration scheme | — |
| Embedded Memory | Embedded array blocks (EABs) | — |
| Embedded Multipliers | Yes (DSP blocks) | — |
| Maximum User I/O | [DATA_NEEDED: maximum usable I/O count for 652 BGA] | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | Yes |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Level MSL | [DATA_NEEDED: moisture sensitivity level] | 3 (168 hours) |
| Family | — | APEX II |
| Embedded System Blocks | — | 425 Kbits |
| Number of DLLs/PLLs | — | 4 PLUs |
| Core Voltage | — | 1.5 V |
| Suhu Kerja | — | 0 C to +85 C (commercial) |
| Configuration Method | — | SRAM-based, JTAG 1149.1 boundary scan |
| Programming File Format | — | .pof / .sof (Quartus) |
| Status Lingkungan Hidup | — | Obsolete - new design not recommended |