EP2A40F672C6N vs EP2A40F672C7ES Perbandingan
Perbandingan bersamaan detil EP2A40F672C6N dari Intel dan EP2A40F672C7ES dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2A40F672C6N | EP2A40F672C7ES |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | APEX II | APEX II |
| Logic Elements | 40,000 | 38400 |
| Maximum System Gates | 1,125,000 | — |
| Embedded RAM Bits | 442,368 | — |
| Embedded System Blocks (ESBs) | 160 | — |
| Maximum User I/O Pins | [DATA_NEEDED: maximum user I/O count] | — |
| Core Voltage | 1.5 V | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, 1.8V/2.5V/3.3V/5V | — |
| Paket | 672-ball FineLine BGA | 672-pin FC-FBGA (FineLine BGA) |
| Suhu Kerja | Commercial (0C to +85C) | 0 °C to +85 °C (commercial) |
| Speed Grade | C6 (per part number suffix) | 7 |
| Configuration Methods | Passive Serial, Passive Parallel, JTAG | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: rohs status] |
| Process Technology | SRAM-based, 0.18 um (per family datasheet) | 0.15 µm CMOS |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Typical Gates | — | 1.5 M |
| Maximum Logic Elements | — | 40960 |
| Maximum Macro Cells | — | 2560 |
| Maximum User I/O | — | 492 |
| Maximum Operating Frequency | — | 562 MHz |
| Core Voltage (VCCINT) | — | 1.5 V |
| I/O Voltage (VCCIO) | — | 3.3 V |
| Package Dimensions | — | 27 × 27 mm |
| Ball Pitch | — | 1.0 mm |
| Status Code | — | ES (Engineering Sample) |