EP2AGX125EF29I3 vs EP2AGX125EF29I5G Perbandingan
Perbandingan bersamaan detil EP2AGX125EF29I3 dari Intel dan EP2AGX125EF29I5G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGX125EF29I3 | EP2AGX125EF29I5G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 118,143 | — |
| Adaptive Logic Modules (ALM) | 49,640 | — |
| Logic Array Blocks (LAB) | 4,964 | — |
| Embedded Memory | 7,892 Kbit (7.93 Mbit) | — |
| User I/Os | 372 | — |
| Number of Terminals | 780 | — |
| Paket / Case | 780-BBGA, FCBGA | — |
| Gaya Mounting | SMD/SMT | — |
| Tegangan Pemuat Kerja | 1.5 V to 3.3 V | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm | 40 nm |
| Suhu Kerja | -40C to +85C (Industrial) | — |
| Speed Grade | -3 (I3) | — |
| Transceivers | Up to 12 multi-gigabit transceivers | — |
| Packaging | Tray | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements | — | 118,143 |
| Embedded Memory Bits | — | 8,315,904 |
| User I/O Pins | — | 372 |
| Paket | — | 780-ball FCBGA (Flip-Chip BGA), 29x29 mm |
| Core Voltage (VCCINT) | — | 0.9 V |
| Transceivers (GX) | — | Up to 12 (3.75 Gbps) |
| Operating Temperature Grade | — | Industrial (I5): -40C to +100C |
| DSP Blocks | — | Yes (18x18 hardware multipliers) |
| PLL Count | — | Multiple per device (family-dependent) |
| External Memory Support | — | DDR/DDR2/DDR3, QDR II, RLDRAM II |
| Hard IP Blocks | — | PCI Express Gen1/Gen2 (PIPE), memory controllers |
| Configuration Scheme | — | JTAG, AS, PS, FPP |
| Tipe Mounting | — | Surface Mount (BGA) |