EP2AGX125EF29I3 vs EP2AGX125EF29I5G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX125EF29I3 sa pamamagitan ng Intel at EP2AGX125EF29I5G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX125EF29I3 | EP2AGX125EF29I5G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 118,143 | — |
| Adaptive Logic Modules (ALM) | 49,640 | — |
| Logic Array Blocks (LAB) | 4,964 | — |
| Embedded Memory | 7,892 Kbit (7.93 Mbit) | — |
| User I/Os | 372 | — |
| Number of Terminals | 780 | — |
| Packhaging / Kaso | 780-BBGA, FCBGA | — |
| Style ng Pagpapasok | SMD/SMT | — |
| Supply Voltage na Operasyon | 1.5 V to 3.3 V | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm | 40 nm |
| Temperature na Operasyon | -40C to +85C (Industrial) | — |
| Speed Grade | -3 (I3) | — |
| Transceivers | Up to 12 multi-gigabit transceivers | — |
| Packaging | Tray | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements | — | 118,143 |
| Embedded Memory Bits | — | 8,315,904 |
| User I/O Pins | — | 372 |
| Packhaging | — | 780-ball FCBGA (Flip-Chip BGA), 29x29 mm |
| Core Voltage (VCCINT) | — | 0.9 V |
| Transceivers (GX) | — | Up to 12 (3.75 Gbps) |
| Operating Temperature Grade | — | Industrial (I5): -40C to +100C |
| DSP Blocks | — | Yes (18x18 hardware multipliers) |
| PLL Count | — | Multiple per device (family-dependent) |
| External Memory Support | — | DDR/DDR2/DDR3, QDR II, RLDRAM II |
| Hard IP Blocks | — | PCI Express Gen1/Gen2 (PIPE), memory controllers |
| Configuration Scheme | — | JTAG, AS, PS, FPP |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |