EP2AGX125EF35I3G vs EP2AGX125EF29I5G Perbandingan
Perbandingan bersamaan detil EP2AGX125EF35I3G dari Intel dan EP2AGX125EF29I5G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP2AGX125EF35I3G - Arria II GX FPGA, 118K LE, 452 I/O | Intel
EP2AGX125EF35I3G ⚠ Waktu Beli Terakhir
Perbandingan Spesifikasi
| Parameter Umum | EP2AGX125EF35I3G | EP2AGX125EF29I5G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Aktif |
| Series | Arria II GX | — |
| Logic Elements | 118143 LE | 118,143 |
| Adaptive Logic Modules (ALMs) | 49640 ALM | — |
| Embedded Memory | 7.93 Mbit | — |
| Total RAM Bits | 8315904 bit | — |
| Number of I/O | 452 | — |
| Paket / Case | 1152-BBGA, FCBGA | — |
| Gaya Mounting | SMD/SMT | — |
| Suhu Kerja | -40C to +100C (Industrial) | — |
| Speed Grade | I3 | — |
| Process Node | 40 nm | — |
| Packaging | Tray | — |
| Status RoHS | Compliant | Compliant |
| Lead Free | Yes | — |
| Transceivers | Up to 8 SERDES channels (per family) | — |
| Family | — | Arria II GX |
| Embedded Memory Bits | — | 8,315,904 |
| User I/O Pins | — | 372 |
| Paket | — | 780-ball FCBGA (Flip-Chip BGA), 29x29 mm |
| Process Technology | — | 40 nm |
| Core Voltage (VCCINT) | — | 0.9 V |
| Transceivers (GX) | — | Up to 12 (3.75 Gbps) |
| Operating Temperature Grade | — | Industrial (I5): -40C to +100C |
| DSP Blocks | — | Yes (18x18 hardware multipliers) |
| PLL Count | — | Multiple per device (family-dependent) |
| External Memory Support | — | DDR/DDR2/DDR3, QDR II, RLDRAM II |
| Hard IP Blocks | — | PCI Express Gen1/Gen2 (PIPE), memory controllers |
| Configuration Scheme | — | JTAG, AS, PS, FPP |
| Tipe Mounting | — | Surface Mount (BGA) |