EP2AGX125EF35I3G vs EP2AGX125EF29I5G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX125EF35I3G disebabkan oleh Intel dan EP2AGX125EF29I5G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2AGX125EF35I3G - Arria II GX FPGA, 118K LE, 452 I/O | Intel
EP2AGX125EF35I3G ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | EP2AGX125EF35I3G | EP2AGX125EF29I5G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Series | Arria II GX | — |
| Logic Elements | 118143 LE | 118,143 |
| Adaptive Logic Modules (ALMs) | 49640 ALM | — |
| Embedded Memory | 7.93 Mbit | — |
| Total RAM Bits | 8315904 bit | — |
| Number of I/O | 452 | — |
| Kemasan / Case | 1152-BBGA, FCBGA | — |
| Gaya Pemasangan | SMD/SMT | — |
| Suhu Operasi | -40C to +100C (Industrial) | — |
| Speed Grade | I3 | — |
| Process Node | 40 nm | — |
| Packaging | Tray | — |
| Status RoHS | Compliant | Compliant |
| Lead Free | Yes | — |
| Transceivers | Up to 8 SERDES channels (per family) | — |
| Family | — | Arria II GX |
| Embedded Memory Bits | — | 8,315,904 |
| User I/O Pins | — | 372 |
| Kemasan | — | 780-ball FCBGA (Flip-Chip BGA), 29x29 mm |
| Process Technology | — | 40 nm |
| Core Voltage (VCCINT) | — | 0.9 V |
| Transceivers (GX) | — | Up to 12 (3.75 Gbps) |
| Operating Temperature Grade | — | Industrial (I5): -40C to +100C |
| DSP Blocks | — | Yes (18x18 hardware multipliers) |
| PLL Count | — | Multiple per device (family-dependent) |
| External Memory Support | — | DDR/DDR2/DDR3, QDR II, RLDRAM II |
| Hard IP Blocks | — | PCI Express Gen1/Gen2 (PIPE), memory controllers |
| Configuration Scheme | — | JTAG, AS, PS, FPP |
| Jenis Pemasangan | — | Surface Mount (BGA) |