EP2AGX125EF35I3G vs EP2AGX125EF29I5G 比較
詳細並排比較 EP2AGX125EF35I3G 由 Intel 與 EP2AGX125EF29I5G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2AGX125EF35I3G | EP2AGX125EF29I5G |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | 啟用中 |
| Series | Arria II GX | — |
| Logic Elements | 118143 LE | 118,143 |
| Adaptive Logic Modules (ALMs) | 49640 ALM | — |
| Embedded Memory | 7.93 Mbit | — |
| Total RAM Bits | 8315904 bit | — |
| Number of I/O | 452 | — |
| 封裝 / 外殼 | 1152-BBGA, FCBGA | — |
| 安裝方式 | SMD/SMT | — |
| 工作溫度 | -40C to +100C (Industrial) | — |
| Speed Grade | I3 | — |
| Process Node | 40 nm | — |
| Packaging | Tray | — |
| RoHS 狀態 | Compliant | Compliant |
| Lead Free | Yes | — |
| Transceivers | Up to 8 SERDES channels (per family) | — |
| Family | — | Arria II GX |
| Embedded Memory Bits | — | 8,315,904 |
| User I/O Pins | — | 372 |
| 封裝 | — | 780-ball FCBGA (Flip-Chip BGA), 29x29 mm |
| Process Technology | — | 40 nm |
| Core Voltage (VCCINT) | — | 0.9 V |
| Transceivers (GX) | — | Up to 12 (3.75 Gbps) |
| Operating Temperature Grade | — | Industrial (I5): -40C to +100C |
| DSP Blocks | — | Yes (18x18 hardware multipliers) |
| PLL Count | — | Multiple per device (family-dependent) |
| External Memory Support | — | DDR/DDR2/DDR3, QDR II, RLDRAM II |
| Hard IP Blocks | — | PCI Express Gen1/Gen2 (PIPE), memory controllers |
| Configuration Scheme | — | JTAG, AS, PS, FPP |
| 安裝類型 | — | Surface Mount (BGA) |