EP2AGX260EF29C5G vs EP2AGX260EF29C6 Perbandingan
Perbandingan bersamaan detil EP2AGX260EF29C5G dari Intel dan EP2AGX260EF29C6 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGX260EF29C5G | EP2AGX260EF29C6 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 260,000 | — |
| Total Memory Bits | 12,038,144 bits | — |
| Embedded RAM Bits | 244,188 bits | — |
| Number of LABs | 10,260 | — |
| User I/O Count | 372 | — |
| Paket | 780-ball FBGA (FineLine BGA) | 780-ball FC-FBGA (EF29) |
| Package Code | HBGA, 29 mm | — |
| Speed Grade | C5 (commercial -5C to 85C) | — |
| Process Node | 40 nm | — |
| Supply Voltage - Core | [DATA_NEEDED: VCCINT nominal] | — |
| Transceivers | Multi-gigabit transceivers (MGTs), count [DATA_NEEDED] | — |
| DSP Blocks | 18x18 multipliers, count [DATA_NEEDED] | — |
| Suhu Kerja | 0C to 85C (commercial) | 0C to +85C (commercial) |
| Tipe Mounting | Surface Mount | Surface Mount (flip-chip BGA) |
| Lead-Free / RoHS | Yes (G suffix) | — |
| Level MSL | [DATA_NEEDED] | — |
| Logic Elements | — | 244,188 |
| Memory Bits | — | 12,038,144 bits |
| Embedded 18x18 Multipliers | — | 612 |
| LABs (Logic Array Blocks) | — | 10,260 |
| User I/O Pins | — | 372 |
| Transceiver Channels | — | 12 |
| Transceiver Data Rate (max) | — | 6.375 Gbps |
| Process Technology | — | 40 nm TSMC |
| Core Voltage | — | 0.9 V |
| Status RoHS | — | [DATA_NEEDED: RoHS status] |
| Design Software | — | Quartus II |