EP2AGX260EF29C5G vs EP2AGX260EF29C6 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX260EF29C5G disebabkan oleh Intel dan EP2AGX260EF29C6 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGX260EF29C5G | EP2AGX260EF29C6 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 260,000 | — |
| Total Memory Bits | 12,038,144 bits | — |
| Embedded RAM Bits | 244,188 bits | — |
| Number of LABs | 10,260 | — |
| User I/O Count | 372 | — |
| Kemasan | 780-ball FBGA (FineLine BGA) | 780-ball FC-FBGA (EF29) |
| Package Code | HBGA, 29 mm | — |
| Speed Grade | C5 (commercial -5C to 85C) | — |
| Process Node | 40 nm | — |
| Supply Voltage - Core | [DATA_NEEDED: VCCINT nominal] | — |
| Transceivers | Multi-gigabit transceivers (MGTs), count [DATA_NEEDED] | — |
| DSP Blocks | 18x18 multipliers, count [DATA_NEEDED] | — |
| Suhu Operasi | 0C to 85C (commercial) | 0C to +85C (commercial) |
| Jenis Pemasangan | Surface Mount | Surface Mount (flip-chip BGA) |
| Lead-Free / RoHS | Yes (G suffix) | — |
| Aras MSL | [DATA_NEEDED] | — |
| Logic Elements | — | 244,188 |
| Memory Bits | — | 12,038,144 bits |
| Embedded 18x18 Multipliers | — | 612 |
| LABs (Logic Array Blocks) | — | 10,260 |
| User I/O Pins | — | 372 |
| Transceiver Channels | — | 12 |
| Transceiver Data Rate (max) | — | 6.375 Gbps |
| Process Technology | — | 40 nm TSMC |
| Core Voltage | — | 0.9 V |
| Status RoHS | — | [DATA_NEEDED: RoHS status] |
| Design Software | — | Quartus II |