EP2AGX45DF29I3N vs EP2AGX45DF29C6G Perbandingan
Perbandingan bersamaan detil EP2AGX45DF29I3N dari Intel dan EP2AGX45DF29C6G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP2AGX45DF29I3N - Arria II GX FPGA 42K LE 364 I/O | Intel
EP2AGX45DF29I3N ⚠ Waktu Beli Terakhir
Perbandingan Spesifikasi
| Parameter Umum | EP2AGX45DF29I3N | EP2AGX45DF29C6G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | NRND |
| Family | Arria II GX | Intel FPGA (formerly Altera) |
| Series | EP2AGX45 | Arria II GX |
| Number of Logic Elements | 42,959 | — |
| Number of LABs/CLBs | 1,805 | — |
| Total RAM Bits | 3,517,440 | — |
| Number of User I/O | 364 | — |
| Suhu Kerja | -40 C to +100 C (industrial) | 0C to +85C (commercial) |
| Speed Grade | I3 | C6 (commercial, mid-speed) |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | — |
| Hard PCIe Controller | PCIe Gen1/Gen2 x1/x4 | — |
| Paket | 780-ball FC-FBGA (DF29) | 780-FBGA (29x29 mm, 1.0 mm pitch) |
| Tipe Mounting | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Maximum User I/O Frequency | 500 MHz Fmax | — |
| Embedded Multipliers | [DATA_NEEDED: 18x18 multiplier count] | — |
| External Memory Support | DDR2, DDR3, QDRII+, RLDRAM II | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 45,000 |
| Embedded Memory Bits | — | 3,517,440 |
| User I/O Count | — | 364 |
| DSP 18x18 Multipliers | — | 312 |
| Transceiver Channels | — | 8 (up to 6.375 Gbps) |
| Process Node | — | 40 nm TSMC low-power |
| Hard IP Blocks | — | PCIe Gen1/Gen2, External Memory Controller |
| Configuration | — | SRAM-based, volatile |
| Level MSL | — | 3 (168 hours) |