EP2AGX45DF29I3N vs EP2AGX45DF29C6G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX45DF29I3N sa pamamagitan ng Intel at EP2AGX45DF29C6G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX45DF29I3N | EP2AGX45DF29C6G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | Arria II GX | Intel FPGA (formerly Altera) |
| Series | EP2AGX45 | Arria II GX |
| Number of Logic Elements | 42,959 | — |
| Number of LABs/CLBs | 1,805 | — |
| Total RAM Bits | 3,517,440 | — |
| Number of User I/O | 364 | — |
| Temperature na Operasyon | -40 C to +100 C (industrial) | 0C to +85C (commercial) |
| Speed Grade | I3 | C6 (commercial, mid-speed) |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | — |
| Hard PCIe Controller | PCIe Gen1/Gen2 x1/x4 | — |
| Packhaging | 780-ball FC-FBGA (DF29) | 780-FBGA (29x29 mm, 1.0 mm pitch) |
| Uri ng Pagpapasok | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Maximum User I/O Frequency | 500 MHz Fmax | — |
| Embedded Multipliers | [DATA_NEEDED: 18x18 multiplier count] | — |
| External Memory Support | DDR2, DDR3, QDRII+, RLDRAM II | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 45,000 |
| Embedded Memory Bits | — | 3,517,440 |
| User I/O Count | — | 364 |
| DSP 18x18 Multipliers | — | 312 |
| Transceiver Channels | — | 8 (up to 6.375 Gbps) |
| Process Node | — | 40 nm TSMC low-power |
| Hard IP Blocks | — | PCIe Gen1/Gen2, External Memory Controller |
| Configuration | — | SRAM-based, volatile |
| Level ng MSL | — | 3 (168 hours) |