EP2AGZ300FF35C3N vs EP2AGZ300FF35C4N Perbandingan
Perbandingan bersamaan detil EP2AGZ300FF35C3N dari Intel dan EP2AGZ300FF35C4N dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGZ300FF35C3N | EP2AGZ300FF35C4N |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | Arria II GZ | — |
| Logic Elements (LE) | 298,000 | — |
| Logic Array Blocks (LABs) | 11,920 | 11,920 |
| Embedded Memory (Bits) | 18,854,912 | — |
| User I/Os | 554 | — |
| Maximum User I/O Pins (Package) | 1,152 | — |
| 18x18 Multipliers | 554 | — |
| Transceivers | Up to 16 channels | Multi-gigabit transceivers integrated |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V | 0.9 V |
| PLLs | 8 | [DATA_NEEDED: PLL count] |
| Paket | 1152-ball FCBGA (FF35) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Operating Temperature Grade | Commercial | Commercial (C4 = 0C to +85C) |
| Series | — | Arria II GZ |
| Logic Elements | — | 298,000 |
| Embedded Memory (bits) | — | 18,854,912 (~17.9 Mbit) |
| User I/O Count | — | 554 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Package Type | — | 1152-BBGA, FCBGA (flip-chip) |
| Terminal Form | — | Ball |
| Package Code (JEDEC) | — | HBGA |
| Configuration Memory | — | SRAM-based (volatile, requires boot device) |
| DSP Blocks | — | [DATA_NEEDED: number of DSP blocks] |
| Status RoHS | — | Compliant (per Besenchips / DigiKey listing) |
| Lead-Free Status | — | Lead free (per Besenchips listing) |
| Maximum Operating Frequency | — | 500 MHz |