EP2AGZ300FF35C3N vs EP2AGZ300FF35C4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ300FF35C3N disebabkan oleh Intel dan EP2AGZ300FF35C4N disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ300FF35C3N | EP2AGZ300FF35C4N |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | Arria II GZ | — |
| Logic Elements (LE) | 298,000 | — |
| Logic Array Blocks (LABs) | 11,920 | 11,920 |
| Embedded Memory (Bits) | 18,854,912 | — |
| User I/Os | 554 | — |
| Maximum User I/O Pins (Package) | 1,152 | — |
| 18x18 Multipliers | 554 | — |
| Transceivers | Up to 16 channels | Multi-gigabit transceivers integrated |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V | 0.9 V |
| PLLs | 8 | [DATA_NEEDED: PLL count] |
| Kemasan | 1152-ball FCBGA (FF35) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Operating Temperature Grade | Commercial | Commercial (C4 = 0C to +85C) |
| Series | — | Arria II GZ |
| Logic Elements | — | 298,000 |
| Embedded Memory (bits) | — | 18,854,912 (~17.9 Mbit) |
| User I/O Count | — | 554 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Package Type | — | 1152-BBGA, FCBGA (flip-chip) |
| Terminal Form | — | Ball |
| Package Code (JEDEC) | — | HBGA |
| Configuration Memory | — | SRAM-based (volatile, requires boot device) |
| DSP Blocks | — | [DATA_NEEDED: number of DSP blocks] |
| Status RoHS | — | Compliant (per Besenchips / DigiKey listing) |
| Lead-Free Status | — | Lead free (per Besenchips listing) |
| Maximum Operating Frequency | — | 500 MHz |