EP2AGZ300FF35I4N vs EP2AGZ300FF35I3G Perbandingan
Perbandingan bersamaan detil EP2AGZ300FF35I4N dari Intel dan EP2AGZ300FF35I3G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGZ300FF35I4N | EP2AGZ300FF35I3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria II GZ | — |
| Family | Field Programmable Gate Array (FPGA) | Arria II GZ |
| Logic Elements | 298,000 | — |
| Number of LABs/CLBs | 11,920 | — |
| Total RAM Bits | 18,854,912 bits | — |
| Number of I/O | 554 | — |
| Supply Voltage Core | 0.9 V | — |
| Process Technology | 40 nm | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | -40C to +100C (Industrial) | -40C to +100 C (I3 industrial) |
| Package Type | 1152-BBGA, FCBGA | — |
| Package Dimensions | 35 mm x 35 mm | — |
| Supplier Device Package | 1152-FBGA (35x35) | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Logic Elements (LE) | — | 300000 |
| Number of User I/O | — | 554 (maximum) |
| Number of Transceivers | — | 8 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Process Node | — | 40 nm |
| Paket | — | 1152-ball FBGA (FF35) |
| Tegangan Pemuat | — | [DATA_NEEDED: core and I/O supply voltage values] |
| Embedded Memory (Mbits) | — | 16.4 |
| DSP Blocks | — | [DATA_NEEDED: number of DSP blocks] |
| PLLs | — | [DATA_NEEDED: number of PLLs] |
| Memory Interfaces | — | DDR3, QDRII+, RLDRAM II |
| Configuration Method | — | Serial, Parallel, JTAG |
| Level MSL | — | 3 (168 hours) |