EP2AGZ300FF35I4N vs EP2AGZ300FF35I3G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ300FF35I4N disebabkan oleh Intel dan EP2AGZ300FF35I3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ300FF35I4N | EP2AGZ300FF35I3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria II GZ | — |
| Family | Field Programmable Gate Array (FPGA) | Arria II GZ |
| Logic Elements | 298,000 | — |
| Number of LABs/CLBs | 11,920 | — |
| Total RAM Bits | 18,854,912 bits | — |
| Number of I/O | 554 | — |
| Supply Voltage Core | 0.9 V | — |
| Process Technology | 40 nm | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | -40C to +100C (Industrial) | -40C to +100 C (I3 industrial) |
| Package Type | 1152-BBGA, FCBGA | — |
| Package Dimensions | 35 mm x 35 mm | — |
| Supplier Device Package | 1152-FBGA (35x35) | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Logic Elements (LE) | — | 300000 |
| Number of User I/O | — | 554 (maximum) |
| Number of Transceivers | — | 8 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Process Node | — | 40 nm |
| Kemasan | — | 1152-ball FBGA (FF35) |
| Tegangan Pemberi Arus | — | [DATA_NEEDED: core and I/O supply voltage values] |
| Embedded Memory (Mbits) | — | 16.4 |
| DSP Blocks | — | [DATA_NEEDED: number of DSP blocks] |
| PLLs | — | [DATA_NEEDED: number of PLLs] |
| Memory Interfaces | — | DDR3, QDRII+, RLDRAM II |
| Configuration Method | — | Serial, Parallel, JTAG |
| Aras MSL | — | 3 (168 hours) |