EP2AGZ350HF40C3N vs EP2AGZ300HF40C3N Perbandingan
Perbandingan bersamaan detil EP2AGZ350HF40C3N dari Intel dan EP2AGZ300HF40C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGZ350HF40C3N | EP2AGZ300HF40C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | 298,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | [DATA_NEEDED: ALM count] |
| Logic Array Blocks (LABs) | 13,940 | 11,920 |
| Embedded Memory Bits | 21,270,528 | — |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| User I/Os | 734 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Transceivers | Up to 24 (per family datasheet) | Up to 12 channels |
| Transceiver Data Rate | Up to 6.553 Gbps | Up to 6.375 Gbps |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 40 nm low-power | 40 nm |
| Paket | 1517-ball FCBGA (HF40) | 1517-BBGA, FCBGA (Flip-Chip BGA) |
| Operating Temperature Grade | Commercial (C3) | — |
| Configuration Mode | FPP / AS / JTAG | — |
| Tipe Mounting | Surface Mount (flip-chip BGA) | — |
| Total Memory Bits | — | 18,854,912 bits (~18.85 Mbit) |
| Embedded Multipliers (18x18) | — | 736 |
| Maximum User I/O | — | 734 |
| Suhu Kerja | — | 0C to +85C (Commercial) |
| Memory Interface Support | — | DDR3-800, DDR2, QDR II+, RLDRAM II |
| PCIe Hard IP | — | PCI Express Gen1 / Gen2 |
| PLL Type | — | Fractional PLL + Multiplier PLL |
| Status RoHS | — | Compliant |
| Status Lingkungan Hidup | — | Obsolete (NRND/EOL per Intel) |
| Configuration Interface | — | JTAG, Passive Serial, Fast Passive Parallel |
| Design Software | — | Quartus II (legacy) |