EP2C70F896C6 vs EP2C70F672C7N Perbandingan
Perbandingan bersamaan detil EP2C70F896C6 dari Intel dan EP2C70F672C7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2C70F896C6 | EP2C70F672C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | NRND |
| Family | Cyclone II | Cyclone II |
| Logic Elements | 68,416 | — |
| Total Memory Bits | 1,152,000 | 1,152,000 |
| M9K Memory Blocks | 622 | — |
| Embedded 18x18 Multipliers | 150 | — |
| PLLs | 4 | 4 |
| Maximum User I/O | 622 (per DigiKey listing) | 422 |
| Maximum Operating Frequency | 500 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Paket | 896-ball FBGA (FineLine BGA) | 672-BGA (FBGA-672) |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Configuration Modes | Active Serial, Passive Serial, JTAG | — |
| Operating Temperature Grade | Commercial (0C to +85C) inferred from speed grade suffix | — |
| Speed Grade | 6 | C7 (slower, lower-power variant) |
| Status RoHS | [DATA_NEEDED: confirmed RoHS compliance status] | Compliant (lead-free FBGA) |
| Logic Elements (LE) | — | 68,416 |
| Embedded Multipliers (18x18) | — | 150 |
| User I/O Banks | — | 8 |
| Suhu Kerja | — | 0C to +85C (Commercial) |
| Supply Voltage - Core | — | 1.15 V to 1.25 V (internal) |
| Supply Voltage - I/O | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-standard) |
| Level MSL | — | 3 (per JEDEC J-STD-020) |
| Configuration Method | — | Serial (AS) or Parallel (PS) via Altera EPCS/EPC configuration devices |