EP2C70F896C6 vs EP2C70F672C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2C70F896C6 sa pamamagitan ng Intel at EP2C70F672C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2C70F896C6 | EP2C70F672C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | Cyclone II | Cyclone II |
| Logic Elements | 68,416 | — |
| Total Memory Bits | 1,152,000 | 1,152,000 |
| M9K Memory Blocks | 622 | — |
| Embedded 18x18 Multipliers | 150 | — |
| PLLs | 4 | 4 |
| Maximum User I/O | 622 (per DigiKey listing) | 422 |
| Maximum Operating Frequency | 500 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Packhaging | 896-ball FBGA (FineLine BGA) | 672-BGA (FBGA-672) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Configuration Modes | Active Serial, Passive Serial, JTAG | — |
| Operating Temperature Grade | Commercial (0C to +85C) inferred from speed grade suffix | — |
| Speed Grade | 6 | C7 (slower, lower-power variant) |
| Tindminan RoHS | [DATA_NEEDED: confirmed RoHS compliance status] | Compliant (lead-free FBGA) |
| Logic Elements (LE) | — | 68,416 |
| Embedded Multipliers (18x18) | — | 150 |
| User I/O Banks | — | 8 |
| Temperature na Operasyon | — | 0C to +85C (Commercial) |
| Supply Voltage - Core | — | 1.15 V to 1.25 V (internal) |
| Supply Voltage - I/O | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-standard) |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |
| Configuration Method | — | Serial (AS) or Parallel (PS) via Altera EPCS/EPC configuration devices |