EP2C8F256I8N vs EP2C8F256C6 Perbandingan
Perbandingan bersamaan detil EP2C8F256I8N dari Intel dan EP2C8F256C6 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP2C8F256C6 - Cyclone II FPGA 8K LE 256-FBGA | Intel / Altera
EP2C8F256C6 ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP2C8F256I8N | EP2C8F256C6 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Waktu Pembelian Terakhir |
| Series | Cyclone II | Cyclone II |
| Logic Elements (LEs) | 8,256 | — |
| Embedded Memory Bits | 165,888 bits | — |
| Total RAM Bits | 165,888 | 165,888 |
| Logic Blocks / Logic Cells | 540 (Logic Cells) | — |
| User I/O Pins | 182 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | 516 |
| Embedded 18x18 Multipliers | Up to 36 | — |
| PLLs | 2 | 4 |
| Global Clock Networks | 16 | — |
| Core Supply Voltage | 1.2 V | — |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Process Technology | 90 nm CMOS (SRAM-based) | — |
| Package Type | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch | — |
| Suhu Kerja | -40C to +85C (industrial) | 0C to +85C (commercial) |
| Configuration Method | SRAM, loaded from external EPCS flash at power-up | — |
| Status RoHS | Compliant (Pb-free, lead-free reflow compatible) | [DATA_NEEDED: rohs status] |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements | — | 8,256 |
| Number of I/O | — | 182 |
| Number of Logic Elements/Cells | — | 8256 |
| Embedded Multipliers | — | 36 (18x18) |
| Paket | — | 256-LBGA (FBGA) |
| Package Pin/Pin Count | — | 256 |
| Process Node | — | 90 nm |
| Tegangan Pemuat | — | 1.15 V to 3.3 V (bank-dependent) |
| Configuration Mode | — | AS / PS / JTAG |
| Level MSL | — | [DATA_NEEDED: MSL level] |