EP2C8F256I8N vs EP2C8F256C6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2C8F256I8N sa pamamagitan ng Intel at EP2C8F256C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2C8F256I8N | EP2C8F256C6 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Series | Cyclone II | Cyclone II |
| Logic Elements (LEs) | 8,256 | — |
| Embedded Memory Bits | 165,888 bits | — |
| Total RAM Bits | 165,888 | 165,888 |
| Logic Blocks / Logic Cells | 540 (Logic Cells) | — |
| User I/O Pins | 182 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | 516 |
| Embedded 18x18 Multipliers | Up to 36 | — |
| PLLs | 2 | 4 |
| Global Clock Networks | 16 | — |
| Core Supply Voltage | 1.2 V | — |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Process Technology | 90 nm CMOS (SRAM-based) | — |
| Package Type | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch | — |
| Temperature na Operasyon | -40C to +85C (industrial) | 0C to +85C (commercial) |
| Configuration Method | SRAM, loaded from external EPCS flash at power-up | — |
| Tindminan RoHS | Compliant (Pb-free, lead-free reflow compatible) | [DATA_NEEDED: rohs status] |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements | — | 8,256 |
| Number of I/O | — | 182 |
| Number of Logic Elements/Cells | — | 8256 |
| Embedded Multipliers | — | 36 (18x18) |
| Packhaging | — | 256-LBGA (FBGA) |
| Package Pin/Pin Count | — | 256 |
| Process Node | — | 90 nm |
| Volte ng Pagbibigay | — | 1.15 V to 3.3 V (bank-dependent) |
| Configuration Mode | — | AS / PS / JTAG |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |