EP2S180F1020C3N vs EP2S180F1020C3 Perbandingan
Perbandingan bersamaan detil EP2S180F1020C3N dari Intel dan EP2S180F1020C3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2S180F1020C3N | EP2S180F1020C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Series | Stratix II | Stratix II |
| Family | Stratix II EP2S180 | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LE) | 179400 | — |
| Total RAM Bits | 9383040 | — |
| Number of LABs | 8970 | — |
| Number of I/O | 742 | — |
| DSP Blocks | 96 | Dedicated high-speed multipliers |
| PLLs | 12 | — |
| Core Voltage - Supply | 1.15 V to 1.25 V | — |
| Suhu Kerja | 0 C to +85 C (Commercial) | Commercial (0C to +85C) |
| Speed Grade | -3 (slower) | C3 |
| Tipe Mounting | Surface Mount | Surface Mount |
| Paket / Case | 1020-BBGA, FCBGA (33 x 33 mm) | — |
| Supplier Device Package | 1020-FBGA (33x33) | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Device Family | — | EP2S180 |
| Equivalent Logic Elements (LEs) | — | 179,400 |
| Logic Array Blocks (LABs) | — | 8,970 |
| Embedded Memory (RAM bits) | — | 9,383,040 |
| Maximum User I/Os | — | 742 |
| Paket | — | 1020-ball FBGA (flip-chip BGA) |
| Process Node | — | 90 nm, all-layer copper SRAM |
| Core Voltage | — | 1.2 V |
| Memory Interfaces Supported | — | DDR2 SDRAM, QDRII SRAM, RLDRAM II |
| I/O Standards | — | LVDS, LVPECL, SSTL, HSTL |
| Configuration Method | — | SRAM-based (volatile, requires boot device) |
| Development Toolchain | — | Quartus II / Quartus Prime |