EP2S180F1020C3N vs EP2S180F1020C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S180F1020C3N sa pamamagitan ng Intel at EP2S180F1020C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2S180F1020C3N | EP2S180F1020C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | Stratix II | Stratix II |
| Family | Stratix II EP2S180 | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LE) | 179400 | — |
| Total RAM Bits | 9383040 | — |
| Number of LABs | 8970 | — |
| Number of I/O | 742 | — |
| DSP Blocks | 96 | Dedicated high-speed multipliers |
| PLLs | 12 | — |
| Core Voltage - Supply | 1.15 V to 1.25 V | — |
| Temperature na Operasyon | 0 C to +85 C (Commercial) | Commercial (0C to +85C) |
| Speed Grade | -3 (slower) | C3 |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packhaging / Kaso | 1020-BBGA, FCBGA (33 x 33 mm) | — |
| Supplier Device Package | 1020-FBGA (33x33) | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Device Family | — | EP2S180 |
| Equivalent Logic Elements (LEs) | — | 179,400 |
| Logic Array Blocks (LABs) | — | 8,970 |
| Embedded Memory (RAM bits) | — | 9,383,040 |
| Maximum User I/Os | — | 742 |
| Packhaging | — | 1020-ball FBGA (flip-chip BGA) |
| Process Node | — | 90 nm, all-layer copper SRAM |
| Core Voltage | — | 1.2 V |
| Memory Interfaces Supported | — | DDR2 SDRAM, QDRII SRAM, RLDRAM II |
| I/O Standards | — | LVDS, LVPECL, SSTL, HSTL |
| Configuration Method | — | SRAM-based (volatile, requires boot device) |
| Development Toolchain | — | Quartus II / Quartus Prime |