EP2S180F1020C3N vs EP2S180F1020C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2S180F1020C3N disebabkan oleh Intel dan EP2S180F1020C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2S180F1020C3N | EP2S180F1020C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Series | Stratix II | Stratix II |
| Family | Stratix II EP2S180 | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LE) | 179400 | — |
| Total RAM Bits | 9383040 | — |
| Number of LABs | 8970 | — |
| Number of I/O | 742 | — |
| DSP Blocks | 96 | Dedicated high-speed multipliers |
| PLLs | 12 | — |
| Core Voltage - Supply | 1.15 V to 1.25 V | — |
| Suhu Operasi | 0 C to +85 C (Commercial) | Commercial (0C to +85C) |
| Speed Grade | -3 (slower) | C3 |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Kemasan / Case | 1020-BBGA, FCBGA (33 x 33 mm) | — |
| Supplier Device Package | 1020-FBGA (33x33) | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Device Family | — | EP2S180 |
| Equivalent Logic Elements (LEs) | — | 179,400 |
| Logic Array Blocks (LABs) | — | 8,970 |
| Embedded Memory (RAM bits) | — | 9,383,040 |
| Maximum User I/Os | — | 742 |
| Kemasan | — | 1020-ball FBGA (flip-chip BGA) |
| Process Node | — | 90 nm, all-layer copper SRAM |
| Core Voltage | — | 1.2 V |
| Memory Interfaces Supported | — | DDR2 SDRAM, QDRII SRAM, RLDRAM II |
| I/O Standards | — | LVDS, LVPECL, SSTL, HSTL |
| Configuration Method | — | SRAM-based (volatile, requires boot device) |
| Development Toolchain | — | Quartus II / Quartus Prime |