EP2S180F1020C4 vs EP2S180F1020C3TT Perbandingan
Perbandingan bersamaan detil EP2S180F1020C4 dari Intel dan EP2S180F1020C3TT dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2S180F1020C4 | EP2S180F1020C3TT |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Family | Stratix II | Stratix II |
| Logic Elements (LEs) | 179400 | 179,400 |
| Adaptive Logic Modules (ALMs) | 89760 (approximate, derived from LE count) | — |
| Equivalent LEs | 179400 | — |
| Logic Array Blocks (LABs) | 8970 | — |
| Total RAM Bits | 9383040 (approx. 1146 Kbit / 1.16 Mbit usable blocks) | — |
| Embedded Multipliers (18x18) | 768 | — |
| PLLs | 12 | — |
| Maximum User I/O | 742 | — |
| Paket | 1020-BBGA (FineLine BGA, FC-FBGA), 33x33 mm | 1020-BBGA (FineLine BGA) |
| Supply Voltage - Core | 1.15 V to 1.25 V (typical 1.2 V) | — |
| Process Technology | 90 nm CMOS | — |
| Suhu Kerja | 0C to +85C (commercial, C4 grade) | — |
| Status RoHS | Non-compliant (per Heisener and alterachips listings) | Compliant |
| Lead Free | [DATA_NEEDED: lead-free status] | — |
| Tipe Mounting | Surface Mount (BGA, ball grid array) | Surface Mount |
| Supplier Device Package | 1020-FBGA (33x33) | — |
| Series | — | EP2S180 |
| Total Memory Bits | — | 9,383,040 |
| User I/O Count | — | 742 |
| Operating Temperature Grade | — | Commercial / Industrial (per suffix) |
| Process Node | — | 90 nm |
| Configuration | — | SRAM-based, in-system reconfigurable |
| Speed Grade | — | C3 |
| Lead-Free | — | Yes |
| Level MSL | — | [DATA_NEEDED: moisture sensitivity level] |
| Logic Block Architecture | — | Adaptive Logic Module (ALM), 8-input fracturable LUT |