EP2S180F1020C4 vs EP2S180F1020C3TT Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2S180F1020C4 disebabkan oleh Intel dan EP2S180F1020C3TT disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2S180F1020C4 | EP2S180F1020C3TT |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Family | Stratix II | Stratix II |
| Logic Elements (LEs) | 179400 | 179,400 |
| Adaptive Logic Modules (ALMs) | 89760 (approximate, derived from LE count) | — |
| Equivalent LEs | 179400 | — |
| Logic Array Blocks (LABs) | 8970 | — |
| Total RAM Bits | 9383040 (approx. 1146 Kbit / 1.16 Mbit usable blocks) | — |
| Embedded Multipliers (18x18) | 768 | — |
| PLLs | 12 | — |
| Maximum User I/O | 742 | — |
| Kemasan | 1020-BBGA (FineLine BGA, FC-FBGA), 33x33 mm | 1020-BBGA (FineLine BGA) |
| Supply Voltage - Core | 1.15 V to 1.25 V (typical 1.2 V) | — |
| Process Technology | 90 nm CMOS | — |
| Suhu Operasi | 0C to +85C (commercial, C4 grade) | — |
| Status RoHS | Non-compliant (per Heisener and alterachips listings) | Compliant |
| Lead Free | [DATA_NEEDED: lead-free status] | — |
| Jenis Pemasangan | Surface Mount (BGA, ball grid array) | Surface Mount |
| Supplier Device Package | 1020-FBGA (33x33) | — |
| Series | — | EP2S180 |
| Total Memory Bits | — | 9,383,040 |
| User I/O Count | — | 742 |
| Operating Temperature Grade | — | Commercial / Industrial (per suffix) |
| Process Node | — | 90 nm |
| Configuration | — | SRAM-based, in-system reconfigurable |
| Speed Grade | — | C3 |
| Lead-Free | — | Yes |
| Aras MSL | — | [DATA_NEEDED: moisture sensitivity level] |
| Logic Block Architecture | — | Adaptive Logic Module (ALM), 8-input fracturable LUT |