EP2S180F1020C4 vs EP2S180F1020C3TT Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S180F1020C4 sa pamamagitan ng Intel at EP2S180F1020C3TT sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2S180F1020C4 | EP2S180F1020C3TT |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | Stratix II | Stratix II |
| Logic Elements (LEs) | 179400 | 179,400 |
| Adaptive Logic Modules (ALMs) | 89760 (approximate, derived from LE count) | — |
| Equivalent LEs | 179400 | — |
| Logic Array Blocks (LABs) | 8970 | — |
| Total RAM Bits | 9383040 (approx. 1146 Kbit / 1.16 Mbit usable blocks) | — |
| Embedded Multipliers (18x18) | 768 | — |
| PLLs | 12 | — |
| Maximum User I/O | 742 | — |
| Packhaging | 1020-BBGA (FineLine BGA, FC-FBGA), 33x33 mm | 1020-BBGA (FineLine BGA) |
| Supply Voltage - Core | 1.15 V to 1.25 V (typical 1.2 V) | — |
| Process Technology | 90 nm CMOS | — |
| Temperature na Operasyon | 0C to +85C (commercial, C4 grade) | — |
| Tindminan RoHS | Non-compliant (per Heisener and alterachips listings) | Compliant |
| Lead Free | [DATA_NEEDED: lead-free status] | — |
| Uri ng Pagpapasok | Surface Mount (BGA, ball grid array) | Surface Mount |
| Supplier Device Package | 1020-FBGA (33x33) | — |
| Series | — | EP2S180 |
| Total Memory Bits | — | 9,383,040 |
| User I/O Count | — | 742 |
| Operating Temperature Grade | — | Commercial / Industrial (per suffix) |
| Process Node | — | 90 nm |
| Configuration | — | SRAM-based, in-system reconfigurable |
| Speed Grade | — | C3 |
| Lead-Free | — | Yes |
| Level ng MSL | — | [DATA_NEEDED: moisture sensitivity level] |
| Logic Block Architecture | — | Adaptive Logic Module (ALM), 8-input fracturable LUT |