EP2S180F1020I4 vs EP2S130F1020I4 Perbandingan
Perbandingan bersamaan detil EP2S180F1020I4 dari Intel dan EP2S130F1020I4 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2S180F1020I4 | EP2S130F1020I4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Series | Stratix II | — |
| Family | Stratix II (EP2S180) | Stratix II |
| Logic Elements | 179,400 | 132,540 |
| Number of LABs/CLBs | 8,970 | — |
| Total RAM Bits | 9,383,040 (8,979,840 per alternate sources) | — |
| Number of I/O | 742 | — |
| Number of DSP Blocks | [DATA_NEEDED: DSP block count per Stratix II EP2S180 datasheet - typically 12] | — |
| Number of PLLs | [DATA_NEEDED: PLL count per EP2S180 datasheet] | — |
| Core Voltage (VCCINT) | 1.2 V | 1.2 V |
| Process Technology | 90 nm CMOS | — |
| Maximum Operating Frequency | 711.24 MHz | — |
| Suhu Kerja | -40C to +100C (Industrial grade, "I4" suffix) | — |
| Paket | 1020-BBGA, FC-FBGA (Flip-Chip FineLine BGA) | 1020-ball FC-FBGA (33x33 mm) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (FC-FBGA) |
| Level MSL | [DATA_NEEDED: MSL rating from Altera packaging spec] | — |
| Status RoHS | Compliant | Compliant (per distributor listings) |
| Lead-Free | Yes | — |
| Configuration Method | Passive serial, Active serial, Fast passive parallel, JTAG | — |
| Configuration Memory Type | SRAM (volatile; requires external configuration device) | — |
| Supplier Device Package | 1020-FBGA | — |
| Base Part Number | EP2S180 | — |
| Equivalent LEs | — | ~180,000 |
| Adaptive Logic Modules (ALMs) | — | 53,016 |
| Embedded Memory (bits) | — | 6,747,840 |
| Embedded Memory (M512 blocks) | — | 530 |
| Embedded Memory (M4K blocks) | — | 768 |
| Embedded Memory (M-RAM blocks) | — | 4 |
| Embedded 18x18 Multipliers | — | 504 |
| DSP Blocks | — | 48 |
| User I/O Pins | — | 742 |
| User I/O Banks | — | 12 |
| Process Node | — | 90 nm CMOS, all-layer copper |
| Speed Grade | — | I (industrial performance) |
| Device Revision | — | 4 |
| Suhu Hubung Kerja | — | -40C to +100C (industrial) |
| Configuration Scheme | — | Fast Passive Parallel x8, Passive Serial, JTAG |