EP2SGX30CF780C4 vs EP2SGX30CF780C3 Perbandingan
Perbandingan bersamaan detil EP2SGX30CF780C4 dari Intel dan EP2SGX30CF780C3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2SGX30CF780C4 | EP2SGX30CF780C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 33,880 | 33,880 |
| Embedded Memory Bits | 1,369,728 | — |
| Maximum User I/Os | 361 | — |
| LABs/CLBs | 1,694 | — |
| Maximum Operating Frequency | 732.1 MHz | — |
| Process Technology | 90 nm | — |
| Core Supply Voltage | 1.2 V | — |
| Paket | 780-BBGA (flip-chip) | 780-ball FineLine BGA |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| AEC-Q100 | Not applicable (FPGA, commercial/industrial) | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Transceivers | Yes (Stratix II GX integrated) | Embedded (GX family, up to 3.125 Gbps per channel) |
| Lead-Free | [DATA_NEEDED: lead-free status] | Yes |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Logic Array Blocks (LABs) | — | 1,694 |
| Embedded RAM Bits | — | 1,369,728 |
| User I/Os | — | 361 |
| Process Node | — | 90 nm |
| Speed Grade | — | -3 |
| Suhu Kerja | — | 0C to +85C (commercial) |
| Memory Interfaces | — | DDR / DDR2 / QDRII PHY |
| Bebas Halogen | — | [DATA_NEEDED: halogen-free status] |