EP2SGX30CF780C4 vs EP2SGX30CF780C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX30CF780C4 disebabkan oleh Intel dan EP2SGX30CF780C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2SGX30CF780C4 | EP2SGX30CF780C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 33,880 | 33,880 |
| Embedded Memory Bits | 1,369,728 | — |
| Maximum User I/Os | 361 | — |
| LABs/CLBs | 1,694 | — |
| Maximum Operating Frequency | 732.1 MHz | — |
| Process Technology | 90 nm | — |
| Core Supply Voltage | 1.2 V | — |
| Kemasan | 780-BBGA (flip-chip) | 780-ball FineLine BGA |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| AEC-Q100 | Not applicable (FPGA, commercial/industrial) | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Transceivers | Yes (Stratix II GX integrated) | Embedded (GX family, up to 3.125 Gbps per channel) |
| Lead-Free | [DATA_NEEDED: lead-free status] | Yes |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Logic Array Blocks (LABs) | — | 1,694 |
| Embedded RAM Bits | — | 1,369,728 |
| User I/Os | — | 361 |
| Process Node | — | 90 nm |
| Speed Grade | — | -3 |
| Suhu Operasi | — | 0C to +85C (commercial) |
| Memory Interfaces | — | DDR / DDR2 / QDRII PHY |
| Boson Bebas | — | [DATA_NEEDED: halogen-free status] |