EP2SGX30CF780I3 vs EP2SGX30CF780C4 Perbandingan
Perbandingan bersamaan detil EP2SGX30CF780I3 dari Intel dan EP2SGX30CF780C4 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel
EP2SGX30CF780I3 ⚠ Waktu Beli Terakhir
Perbandingan Spesifikasi
| Parameter Umum | EP2SGX30CF780I3 | EP2SGX30CF780C4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Logic Cells | 33,880 | — |
| Logic Array Blocks (LABs) | 33,880 | — |
| Maximum Internal Frequency | 622.08 MHz | — |
| Number of User I/O Pins | 361 | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Voltage | 1.2 V | — |
| Transceivers | Embedded multi-gigabit transceivers (6.375 Gbps) | Yes (Stratix II GX integrated) |
| Paket | 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) | 780-BBGA (flip-chip) |
| Terminal Pitch | 1.0 mm | — |
| Suhu Kerja | -40 °C to +85 °C (Industrial) | — |
| Temperature Grade Suffix | I3 (Industrial) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Total Terminals | 780 | — |
| Package Code | BGA, square shape | — |
| Status RoHS | [DATA_NEEDED: RoHS status not confirmed in supplied data] | [DATA_NEEDED: RoHS status] |
| Logic Elements | — | 33,880 |
| Embedded Memory Bits | — | 1,369,728 |
| Maximum User I/Os | — | 361 |
| LABs/CLBs | — | 1,694 |
| Maximum Operating Frequency | — | 732.1 MHz |
| Core Supply Voltage | — | 1.2 V |
| AEC-Q100 | — | Not applicable (FPGA, commercial/industrial) |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Level MSL | — | [DATA_NEEDED: MSL level] |