EP2SGX30DF780I4 vs EP2SGX30DF780C5 Perbandingan
Perbandingan bersamaan detil EP2SGX30DF780I4 dari Intel dan EP2SGX30DF780C5 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP2SGX30DF780I4 - 33,880 Logic Cells Stratix II GX FPGA | Intel
EP2SGX30DF780I4 ⚠ Waktu Beli Terakhir
Perbandingan Spesifikasi
| Parameter Umum | EP2SGX30DF780I4 | EP2SGX30DF780C5 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Obsolete |
| Series | Stratix II GX | — |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements / Cells | 33,880 | — |
| Total RAM Bits | 1,369,728 | 1,369,728 bits |
| Number of LABs | 1,694 | — |
| User I/O Count | 361 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Nominal Supply Voltage (Core) | 1.2 V | — |
| Internal Operating Frequency | 622 MHz | — |
| Frekuensi Bawah Maximum | 717 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Suhu Kerja | -40C to +85C (Industrial) | -40C to +85C (commercial) |
| Paket | 780-ball FC-FBGA, 29x29 mm, 1 mm pitch | 780-ball FBGA (FC-FBGA), 29 x 29 mm, 1 mm pitch |
| Tipe Mounting | Surface Mount (Flip-chip BGA) | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status from verified data] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Number of Transceivers | [DATA_NEEDED: number of transceiver channels] | — |
| Number of PLLs / DLLs | [DATA_NEEDED: number of PLLs] | — |
| Logic Elements (LE) | — | 33,880 |
| LABs/CLBs | — | 1694 |
| Number of Logic Cells | — | 33,880 cells |
| Maximum User I/Os | — | 361 |
| Transceiver Channels | — | 4 (up to 3.125 Gbps each) |
| Internal Frequency (max) | — | 609.76 MHz |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | -5 |