EP2SGX30DF780I4 vs EP2SGX30DF780C5 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX30DF780I4 disebabkan oleh Intel dan EP2SGX30DF780C5 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX30DF780I4 - 33,880 Logic Cells Stratix II GX FPGA | Intel
EP2SGX30DF780I4 ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | EP2SGX30DF780I4 | EP2SGX30DF780C5 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Obsolete |
| Series | Stratix II GX | — |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements / Cells | 33,880 | — |
| Total RAM Bits | 1,369,728 | 1,369,728 bits |
| Number of LABs | 1,694 | — |
| User I/O Count | 361 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Nominal Supply Voltage (Core) | 1.2 V | — |
| Internal Operating Frequency | 622 MHz | — |
| Frekuensi Klock Maksimum | 717 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Suhu Operasi | -40C to +85C (Industrial) | -40C to +85C (commercial) |
| Kemasan | 780-ball FC-FBGA, 29x29 mm, 1 mm pitch | 780-ball FBGA (FC-FBGA), 29 x 29 mm, 1 mm pitch |
| Jenis Pemasangan | Surface Mount (Flip-chip BGA) | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status from verified data] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Number of Transceivers | [DATA_NEEDED: number of transceiver channels] | — |
| Number of PLLs / DLLs | [DATA_NEEDED: number of PLLs] | — |
| Logic Elements (LE) | — | 33,880 |
| LABs/CLBs | — | 1694 |
| Number of Logic Cells | — | 33,880 cells |
| Maximum User I/Os | — | 361 |
| Transceiver Channels | — | 4 (up to 3.125 Gbps each) |
| Internal Frequency (max) | — | 609.76 MHz |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | -5 |