EP2SGX60CF780C3 vs EP2SGX60CF780C3N Perbandingan
Perbandingan bersamaan detil EP2SGX60CF780C3 dari Intel dan EP2SGX60CF780C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel
EP2SGX60CF780C3N ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP2SGX60CF780C3 | EP2SGX60CF780C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Waktu Pembelian Terakhir |
| Family | Stratix II GX | — |
| Device Type | FPGA - Field Programmable Gate Array | FPGA (Field Programmable Gate Array) |
| Logic Elements | 60,440 | 60,440 |
| Logic Array Blocks (LABs) | 3,022 | [DATA_NEEDED: LAB count] |
| On-chip RAM Bits | 2,544,192 (~317 KB) | — |
| User I/Os | 364 | — |
| Transceivers | Up to 12 multi-gigabit transceivers (per family datasheet) | — |
| Transceiver Data Rate (max) | 6.375 Gbps (per Stratix II GX family datasheet) | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm CMOS, SRAM-based | 90 nm CMOS |
| Speed Grade | C3 (commercial) | — |
| Paket | 780-ball FineLine BGA (FBGA-780), 29 mm x 29 mm, 1.0 mm pitch | — |
| Suhu Kerja | Commercial (0C to +85C junction) | — |
| Tipe Mounting | Surface Mount (BGA) | — |
| Level MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL rating] |
| Status RoHS | [DATA_NEEDED: RoHS status] | Lead-free / Compliant |
| Series | — | Stratix II GX |
| User I/O Pins | — | 364 |
| Embedded Memory (bits) | — | 2,544,192 |
| Number of CLBs | — | 60,440 |
| Internal Frequency (max) | — | 816.9 MHz |
| Core Supply Voltage | — | 1.2 V |
| Transceiver Channels | — | 12 (up to 6.375 Gbps) |
| Package Type | — | 780-ball FC-FBGA |
| Package Dimensions | — | 29 mm x 29 mm, 1.0 mm pitch |