EP2SGX60CF780C3 vs EP2SGX60CF780C3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX60CF780C3 disebabkan oleh Intel dan EP2SGX60CF780C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel
EP2SGX60CF780C3N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2SGX60CF780C3 | EP2SGX60CF780C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Masa Terakhir Dibeli |
| Family | Stratix II GX | — |
| Device Type | FPGA - Field Programmable Gate Array | FPGA (Field Programmable Gate Array) |
| Logic Elements | 60,440 | 60,440 |
| Logic Array Blocks (LABs) | 3,022 | [DATA_NEEDED: LAB count] |
| On-chip RAM Bits | 2,544,192 (~317 KB) | — |
| User I/Os | 364 | — |
| Transceivers | Up to 12 multi-gigabit transceivers (per family datasheet) | — |
| Transceiver Data Rate (max) | 6.375 Gbps (per Stratix II GX family datasheet) | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm CMOS, SRAM-based | 90 nm CMOS |
| Speed Grade | C3 (commercial) | — |
| Kemasan | 780-ball FineLine BGA (FBGA-780), 29 mm x 29 mm, 1.0 mm pitch | — |
| Suhu Operasi | Commercial (0C to +85C junction) | — |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Aras MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL rating] |
| Status RoHS | [DATA_NEEDED: RoHS status] | Lead-free / Compliant |
| Series | — | Stratix II GX |
| User I/O Pins | — | 364 |
| Embedded Memory (bits) | — | 2,544,192 |
| Number of CLBs | — | 60,440 |
| Internal Frequency (max) | — | 816.9 MHz |
| Core Supply Voltage | — | 1.2 V |
| Transceiver Channels | — | 12 (up to 6.375 Gbps) |
| Package Type | — | 780-ball FC-FBGA |
| Package Dimensions | — | 29 mm x 29 mm, 1.0 mm pitch |