EP2SGX60CF780C3 vs EP2SGX60CF780C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60CF780C3 sa pamamagitan ng Intel at EP2SGX60CF780C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel
EP2SGX60CF780C3N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2SGX60CF780C3 | EP2SGX60CF780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Family | Stratix II GX | — |
| Device Type | FPGA - Field Programmable Gate Array | FPGA (Field Programmable Gate Array) |
| Logic Elements | 60,440 | 60,440 |
| Logic Array Blocks (LABs) | 3,022 | [DATA_NEEDED: LAB count] |
| On-chip RAM Bits | 2,544,192 (~317 KB) | — |
| User I/Os | 364 | — |
| Transceivers | Up to 12 multi-gigabit transceivers (per family datasheet) | — |
| Transceiver Data Rate (max) | 6.375 Gbps (per Stratix II GX family datasheet) | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm CMOS, SRAM-based | 90 nm CMOS |
| Speed Grade | C3 (commercial) | — |
| Packhaging | 780-ball FineLine BGA (FBGA-780), 29 mm x 29 mm, 1.0 mm pitch | — |
| Temperature na Operasyon | Commercial (0C to +85C junction) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Level ng MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL rating] |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Lead-free / Compliant |
| Series | — | Stratix II GX |
| User I/O Pins | — | 364 |
| Embedded Memory (bits) | — | 2,544,192 |
| Number of CLBs | — | 60,440 |
| Internal Frequency (max) | — | 816.9 MHz |
| Core Supply Voltage | — | 1.2 V |
| Transceiver Channels | — | 12 (up to 6.375 Gbps) |
| Package Type | — | 780-ball FC-FBGA |
| Package Dimensions | — | 29 mm x 29 mm, 1.0 mm pitch |