EP2SGX60DF780C3N vs EP2SGX60DF780C7 Perbandingan
Perbandingan bersamaan detil EP2SGX60DF780C3N dari Intel dan EP2SGX60DF780C7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP2SGX60DF780C7 - Stratix II GX 60K LE FPGA, 364 I/O, 780-BGA | Intel
EP2SGX60DF780C7 ObsoletePerbandingan Spesifikasi
| Parameter Umum | EP2SGX60DF780C3N | EP2SGX60DF780C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Akhir Hidup | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Device Type | FPGA | — |
| Logic Elements | 60,440 | 60,440 |
| LABs/CLBs | 3,022 | — |
| Total Memory Bits | 2,544,192 | — |
| User I/Os | 364 | — |
| Package Type | 780-pin FC-FBGA (DF780) | — |
| Package Dimensions | 23 x 23 mm | — |
| Pitch | 1 mm | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm | 90 nm |
| Internal Frequency | 717 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | — |
| Suhu Kerja | [DATA_NEEDED: operating temperature range C] | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant (per distributor listing) | [DATA_NEEDED: RoHS status] |
| Logic Array Blocks (LABs) | — | 3,022 |
| Total RAM Bits | — | 2,544,192 |
| User I/O Pins | — | 364 |
| Paket | — | 780-ball FBGA (FineLine BGA) |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Operating Junction Temperature (Commercial) | — | 0 C to 85 C |
| Speed Grade | — | C7 (slowest commercial) |
| Level MSL | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Design Software | — | Quartus II (legacy, EOL toolchain) |