EP2SGX60EF1152C3 vs EP2SGX60EF1152C5N Perbandingan
Perbandingan bersamaan detil EP2SGX60EF1152C3 dari Intel dan EP2SGX60EF1152C5N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP2SGX60EF1152C3 - Stratix II GX FPGA 60K LE 1152-FBGA | Intel
EP2SGX60EF1152C3 ⚠ Waktu Beli TerakhirIntel
EP2SGX60EF1152C5N - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
EP2SGX60EF1152C5N ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP2SGX60EF1152C3 | EP2SGX60EF1152C5N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Waktu Pembelian Terakhir |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | — |
| LABs / CLBs | 3,022 | — |
| User I/Os | 534 | — |
| Total Memory Bits | 2,544,192 | — |
| Number of Transceivers | 36 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Internal Frequency | 717 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm CMOS |
| Multipliers (18x18) | 252 | — |
| Paket | 1152-ball FC-FBGA (35 x 35 mm) | 1152-ball FC-FBGA |
| Tipe Mounting | Surface Mount | Surface Mount (Flip-Chip BGA) |
| Suhu Kerja | 0C to +85C (Commercial, C3 suffix) | Commercial (0C to +85C) |
| Configuration Memory Interface | EPCS serial configuration devices | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | [DATA_NEEDED: lead-free status] |
| Family | — | Stratix II GX |
| Logic Elements (LE) | — | 60,440 |
| Logic Array Blocks (LABs) | — | 3022 |
| Embedded Memory Bits | — | 2,544,192 |
| User I/O Count | — | 534 |
| Maximum Operating Frequency | — | 609.76 MHz |
| Speed Grade | — | -5 (mid) |
| Level MSL | — | [DATA_NEEDED: MSL level] |