EP2SGX60EF1152C3 vs EP2SGX60EF1152C5N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60EF1152C3 sa pamamagitan ng Intel at EP2SGX60EF1152C5N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX60EF1152C3 - Stratix II GX FPGA 60K LE 1152-FBGA | Intel
EP2SGX60EF1152C3 ⚠ Huling PagbiliIntel
EP2SGX60EF1152C5N - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
EP2SGX60EF1152C5N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2SGX60EF1152C3 | EP2SGX60EF1152C5N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | — |
| LABs / CLBs | 3,022 | — |
| User I/Os | 534 | — |
| Total Memory Bits | 2,544,192 | — |
| Number of Transceivers | 36 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Internal Frequency | 717 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm CMOS |
| Multipliers (18x18) | 252 | — |
| Packhaging | 1152-ball FC-FBGA (35 x 35 mm) | 1152-ball FC-FBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (Flip-Chip BGA) |
| Temperature na Operasyon | 0C to +85C (Commercial, C3 suffix) | Commercial (0C to +85C) |
| Configuration Memory Interface | EPCS serial configuration devices | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | [DATA_NEEDED: lead-free status] |
| Family | — | Stratix II GX |
| Logic Elements (LE) | — | 60,440 |
| Logic Array Blocks (LABs) | — | 3022 |
| Embedded Memory Bits | — | 2,544,192 |
| User I/O Count | — | 534 |
| Maximum Operating Frequency | — | 609.76 MHz |
| Speed Grade | — | -5 (mid) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |