EP2SGX60EF1152C3 vs EP2SGX60EF1152C5N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX60EF1152C3 disebabkan oleh Intel dan EP2SGX60EF1152C5N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX60EF1152C3 - Stratix II GX FPGA 60K LE 1152-FBGA | Intel
EP2SGX60EF1152C3 ⚠ Bahagian terakhir untuk beliIntel
EP2SGX60EF1152C5N - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
EP2SGX60EF1152C5N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2SGX60EF1152C3 | EP2SGX60EF1152C5N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Masa Terakhir Dibeli |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | — |
| LABs / CLBs | 3,022 | — |
| User I/Os | 534 | — |
| Total Memory Bits | 2,544,192 | — |
| Number of Transceivers | 36 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Internal Frequency | 717 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm CMOS |
| Multipliers (18x18) | 252 | — |
| Kemasan | 1152-ball FC-FBGA (35 x 35 mm) | 1152-ball FC-FBGA |
| Jenis Pemasangan | Surface Mount | Surface Mount (Flip-Chip BGA) |
| Suhu Operasi | 0C to +85C (Commercial, C3 suffix) | Commercial (0C to +85C) |
| Configuration Memory Interface | EPCS serial configuration devices | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | [DATA_NEEDED: lead-free status] |
| Family | — | Stratix II GX |
| Logic Elements (LE) | — | 60,440 |
| Logic Array Blocks (LABs) | — | 3022 |
| Embedded Memory Bits | — | 2,544,192 |
| User I/O Count | — | 534 |
| Maximum Operating Frequency | — | 609.76 MHz |
| Speed Grade | — | -5 (mid) |
| Aras MSL | — | [DATA_NEEDED: MSL level] |