EP2SGX90EF1152C3N vs EP2SGX60EF1152C3N Perbandingan

Perbandingan bersamaan detil EP2SGX90EF1152C3N dari Intel dan EP2SGX60EF1152C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP2SGX90EF1152C3N EP2SGX60EF1152C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Obsolete
Series Stratix II GX Stratix II
Family Stratix II GX Stratix II GX
Logic Elements (LE) 90960 —
Number of LABs/CLBs 4548 —
Total Memory Bits 4520448 —
User I/Os 558 —
Number of Transceivers [DATA_NEEDED: transceiver count per family] —
Process Technology 90 nm 90 nm CMOS
Core Voltage 1.2 V —
Operating Frequency (max) 816.9 MHz —
Suhu Kerja 0C to +85C (Commercial) 0C to +85C (commercial)
Package Type FC-FBGA (Flip-Chip Fine-pitch BGA) —
Package Pin Count 1152 balls —
Package Dimensions 34 mm x 34 mm —
Tipe Mounting Surface Mount Surface Mount (BGA)
Lead-Free / RoHS Yes (RoHS compliant) —
Speed Grade EF C3 (commercial, -3 bin)
Temperature Grade C3 (Commercial) —
Logic Elements — 60,440
Adaptive Logic Modules (ALMs) — 30,220
Logic Array Blocks (LABs) — 3022
Embedded Memory (bits) — 2,544,192
Maximum User I/Os — 534
Core Voltage (Vcc) — 1.2 V
Maximum Internal Frequency — 717 MHz
Propagation Delay — 0.40 ns
Embedded Multipliers (18x18) — [DATA_NEEDED: embedded multiplier count]
PLLs — 4
Transceiver Data Rate — 3.125 Gbps per channel
Paket — 1152-BBGA (FC-FBGA) 35 x 35 mm, 1.0 mm pitch

Spek dan Sumber

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