EP3C10F256C6 vs EP3C10F256C6N Perbandingan
Perbandingan bersamaan detil EP3C10F256C6 dari Intel dan EP3C10F256C6N dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C10F256C6 | EP3C10F256C6N |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 10,320 | 10,320 |
| Total Memory Bits | 423,936 bits | 423,936 bits |
| Embedded 18x18 Multipliers | 23 | 46 |
| PLLs | 2 | 2 |
| Maximum User I/Os | 182 | 182 |
| Paket | 256-FBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) | 256-ball FineLine BGA (FBGA-256) |
| Tipe Mounting | Surface Mount (BGA) | — |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V (typ. 1.2 V) | 1.2 V |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Process Technology | 60 nm low-power CMOS | — |
| Configuration Memory | SRAM-based (external EPCS flash required) | — |
| Suhu Kerja | -40 C to +125 C (industrial, suffix 'C') | — |
| Speed Grade | 6 | — |
| Status RoHS | Compliant (lead-free FBGA) | Compliant (lead-free N suffix) |
| Level MSL | 3 (168 hours) | — |
| Embedded Memory (M9K blocks) | — | 46 blocks x 9 Kbit |
| Global Clock Networks | — | 20 |
| Process Node | — | 65 nm low power (TSMC) |
| Configuration Modes | — | JTAG, Active Serial (AS), Active Parallel (AP) |
| I/O Standards | — | LVTTL, LVCMOS, SSTL, LVDS, RSDS, mini-LVDS, PPDS |
| Operating Temperature (Commercial) | — | 0C to +85C (C6 speed grade, N = lead-free) |
| Programming Tool | — | Intel Quartus II (Cyclone III device support) |