EP3C10F256C6 vs EP3C10F256C6N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C10F256C6 disebabkan oleh Intel dan EP3C10F256C6N disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C10F256C6 | EP3C10F256C6N |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 10,320 | 10,320 |
| Total Memory Bits | 423,936 bits | 423,936 bits |
| Embedded 18x18 Multipliers | 23 | 46 |
| PLLs | 2 | 2 |
| Maximum User I/Os | 182 | 182 |
| Kemasan | 256-FBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) | 256-ball FineLine BGA (FBGA-256) |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V (typ. 1.2 V) | 1.2 V |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Process Technology | 60 nm low-power CMOS | — |
| Configuration Memory | SRAM-based (external EPCS flash required) | — |
| Suhu Operasi | -40 C to +125 C (industrial, suffix 'C') | — |
| Speed Grade | 6 | — |
| Status RoHS | Compliant (lead-free FBGA) | Compliant (lead-free N suffix) |
| Aras MSL | 3 (168 hours) | — |
| Embedded Memory (M9K blocks) | — | 46 blocks x 9 Kbit |
| Global Clock Networks | — | 20 |
| Process Node | — | 65 nm low power (TSMC) |
| Configuration Modes | — | JTAG, Active Serial (AS), Active Parallel (AP) |
| I/O Standards | — | LVTTL, LVCMOS, SSTL, LVDS, RSDS, mini-LVDS, PPDS |
| Operating Temperature (Commercial) | — | 0C to +85C (C6 speed grade, N = lead-free) |
| Programming Tool | — | Intel Quartus II (Cyclone III device support) |