EP3C25F324C6N vs EP3C25F324C8N Perbandingan
Perbandingan bersamaan detil EP3C25F324C6N dari Intel dan EP3C25F324C8N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C25F324C6N | EP3C25F324C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III | Cyclone III |
| Family | Cyclone III (low-power, low-cost FPGA) | Cyclone III |
| Logic Elements (LE) | 24,624 | — |
| Total Memory Bits | 608,256 bits | 608,256 bits |
| Embedded Memory Blocks | M9K blocks, 66 total | — |
| Embedded Multipliers | 66 (18x18) | — |
| DSP Blocks | 66 dedicated 18x18 multipliers | — |
| User I/O Pins | 215 | — |
| Number of I/O Banks | 8 | — |
| PLLs | 4 general-purpose PLLs | — |
| Paket | 324-BGA (FBGA-324), fine-pitch | 324-BGA (FineLine) |
| Speed Grade | C6 (commercial) | 8 |
| Suhu Kerja | 0C to +85C (commercial) | 0 C to +85 C (commercial, suffix C) |
| Process Technology | TSMC 65 nm low-power (LP) | — |
| Configuration Schemes | Passive Serial, Fast Passive Parallel, JTAG | — |
| Lead-Free / RoHS | Yes (lead-free, RoHS compliant) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Logic Elements (LEs) | — | 24,624 |
| Embedded Memory (Kbits) | — | 608 Kbits |
| Number of I/O | — | 215 |
| Supply Voltage - Core | — | 1.2 V |
| Total RAM Bits | — | 608,256 |
| Process Node | — | 60 nm low-power CMOS |
| Number of Multipliers (18x18) | — | 66 |
| Number of PLLs | — | 4 |
| Status RoHS | — | Compliant |