EP3C25F324C6N vs EP3C25F324C8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C25F324C6N disebabkan oleh Intel dan EP3C25F324C8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C25F324C6N | EP3C25F324C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III | Cyclone III |
| Family | Cyclone III (low-power, low-cost FPGA) | Cyclone III |
| Logic Elements (LE) | 24,624 | — |
| Total Memory Bits | 608,256 bits | 608,256 bits |
| Embedded Memory Blocks | M9K blocks, 66 total | — |
| Embedded Multipliers | 66 (18x18) | — |
| DSP Blocks | 66 dedicated 18x18 multipliers | — |
| User I/O Pins | 215 | — |
| Number of I/O Banks | 8 | — |
| PLLs | 4 general-purpose PLLs | — |
| Kemasan | 324-BGA (FBGA-324), fine-pitch | 324-BGA (FineLine) |
| Speed Grade | C6 (commercial) | 8 |
| Suhu Operasi | 0C to +85C (commercial) | 0 C to +85 C (commercial, suffix C) |
| Process Technology | TSMC 65 nm low-power (LP) | — |
| Configuration Schemes | Passive Serial, Fast Passive Parallel, JTAG | — |
| Lead-Free / RoHS | Yes (lead-free, RoHS compliant) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Logic Elements (LEs) | — | 24,624 |
| Embedded Memory (Kbits) | — | 608 Kbits |
| Number of I/O | — | 215 |
| Supply Voltage - Core | — | 1.2 V |
| Total RAM Bits | — | 608,256 |
| Process Node | — | 60 nm low-power CMOS |
| Number of Multipliers (18x18) | — | 66 |
| Number of PLLs | — | 4 |
| Status RoHS | — | Compliant |