EP3C25F324C6N vs EP3C25F324C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C25F324C6N sa pamamagitan ng Intel at EP3C25F324C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C25F324C6N | EP3C25F324C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone III | Cyclone III |
| Family | Cyclone III (low-power, low-cost FPGA) | Cyclone III |
| Logic Elements (LE) | 24,624 | — |
| Total Memory Bits | 608,256 bits | 608,256 bits |
| Embedded Memory Blocks | M9K blocks, 66 total | — |
| Embedded Multipliers | 66 (18x18) | — |
| DSP Blocks | 66 dedicated 18x18 multipliers | — |
| User I/O Pins | 215 | — |
| Number of I/O Banks | 8 | — |
| PLLs | 4 general-purpose PLLs | — |
| Packhaging | 324-BGA (FBGA-324), fine-pitch | 324-BGA (FineLine) |
| Speed Grade | C6 (commercial) | 8 |
| Temperature na Operasyon | 0C to +85C (commercial) | 0 C to +85 C (commercial, suffix C) |
| Process Technology | TSMC 65 nm low-power (LP) | — |
| Configuration Schemes | Passive Serial, Fast Passive Parallel, JTAG | — |
| Lead-Free / RoHS | Yes (lead-free, RoHS compliant) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Logic Elements (LEs) | — | 24,624 |
| Embedded Memory (Kbits) | — | 608 Kbits |
| Number of I/O | — | 215 |
| Supply Voltage - Core | — | 1.2 V |
| Total RAM Bits | — | 608,256 |
| Process Node | — | 60 nm low-power CMOS |
| Number of Multipliers (18x18) | — | 66 |
| Number of PLLs | — | 4 |
| Tindminan RoHS | — | Compliant |