EP3C25F324C7N vs EP3C25F324C8 Perbandingan
Perbandingan bersamaan detil EP3C25F324C7N dari Intel dan EP3C25F324C8 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C25F324C7N | EP3C25F324C8 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Device Family | Cyclone III | — |
| Logic Cells | 24,624 cells | — |
| Embedded Memory | 608,256 bits | 608,256 bits |
| Available I/O Pins | 215 I/O | — |
| Maximum Listed Frequency | 437.5 MHz | — |
| Process Technology | 65 nm | 65 nm CMOS, SRAM-based |
| Core Voltage | 1.2 V | 1.2 V |
| Paket | 324-ball FBGA | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Terminal Count | 324 terminals | — |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Package Shape | Rectangular | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Temperature Grading | Other | — |
| Programmability | Field programmable | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Non-compliant (per Lisleapex listing; original part number without 'N' suffix) |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Series | — | Cyclone III |
| Logic Elements | — | 24,624 LE |
| Logic Array Blocks | — | 1,539 LABs |
| Embedded Multipliers | — | 66 (18 x 18) |
| User I/Os | — | 215 |
| PLLs | — | 4 |
| Speed Grade | — | 8 (commercial) |
| Suhu Kerja | — | 0 °C to +85 °C (commercial) |
| Maximum Internal Clock | — | 402 MHz |