EP3C25F324C7N vs EP3C25F324C8 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C25F324C7N sa pamamagitan ng Intel at EP3C25F324C8 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C25F324C7N | EP3C25F324C8 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Device Family | Cyclone III | — |
| Logic Cells | 24,624 cells | — |
| Embedded Memory | 608,256 bits | 608,256 bits |
| Available I/O Pins | 215 I/O | — |
| Maximum Listed Frequency | 437.5 MHz | — |
| Process Technology | 65 nm | 65 nm CMOS, SRAM-based |
| Core Voltage | 1.2 V | 1.2 V |
| Packhaging | 324-ball FBGA | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Terminal Count | 324 terminals | — |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Package Shape | Rectangular | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Temperature Grading | Other | — |
| Programmability | Field programmable | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Non-compliant (per Lisleapex listing; original part number without 'N' suffix) |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Series | — | Cyclone III |
| Logic Elements | — | 24,624 LE |
| Logic Array Blocks | — | 1,539 LABs |
| Embedded Multipliers | — | 66 (18 x 18) |
| User I/Os | — | 215 |
| PLLs | — | 4 |
| Speed Grade | — | 8 (commercial) |
| Temperature na Operasyon | — | 0 °C to +85 °C (commercial) |
| Maximum Internal Clock | — | 402 MHz |