EP3C25F324C8N vs EP3C25F324I7N Perbandingan
Perbandingan bersamaan detil EP3C25F324C8N dari Intel dan EP3C25F324I7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C25F324C8N | EP3C25F324I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Series | Cyclone III | — |
| Logic Elements (LEs) | 24,624 | 24,624 |
| Total Memory Bits | 608,256 bits | — |
| Embedded Memory (Kbits) | 608 Kbits | — |
| Number of I/O | 215 | — |
| Paket | 324-BGA (FineLine) | 324-ball FBGA (Fine-Pitch BGA) |
| Supply Voltage - Core | 1.2 V | — |
| Tipe Mounting | Surface Mount | — |
| Suhu Kerja | 0 C to +85 C (commercial, suffix C) | -40C to +100C (Industrial) |
| Speed Grade | 8 | 7 (slower speed grade, lower power) |
| Total RAM Bits | 608,256 | — |
| Process Node | 60 nm low-power CMOS | — |
| Number of Multipliers (18x18) | 66 | — |
| Number of PLLs | 4 | — |
| Status RoHS | Compliant | Compliant |
| Embedded Memory | — | 608,256 bits (66 M9K blocks of 9 Kbits each) |
| Embedded 18x18 Multipliers | — | 66 |
| Maximum User I/O Pins | — | 215 |
| LVDS Pairs | — | 66 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Process Technology | — | 65 nm |
| Core Voltage | — | 1.2 V |
| I/O Bank Voltage Range | — | 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) |
| Lead-Free | — | Yes |
| Level MSL | — | 3 (168 hours) |